- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 37/32 - Retaining rings
Patent holdings for IPC class B24B 37/32
Total number of patents in this class: 271
10-year publication summary
24
|
25
|
20
|
22
|
33
|
24
|
21
|
41
|
43
|
10
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 16587 |
110 |
Ebara Corporation | 1951 |
64 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
29 |
Samsung Electronics Co., Ltd. | 131630 |
7 |
Shin-Etsu Handotai Co., Ltd. | 1277 |
7 |
Sumco Corporation | 1116 |
6 |
Fujikoshi Machinery Corp. | 54 |
3 |
Micro Engineering Inc. | 5 |
3 |
Infineon Technologies AG | 8189 |
2 |
Axus Technology, LLC | 30 |
2 |
Will Be S & T Co., Ltd. | 6 |
2 |
GLOBALFOUNDRIES Singapore Pte. Ltd. | 734 |
2 |
Kioxia Corporation | 9847 |
2 |
SMT Corporation | 9 |
2 |
Xia Tai Xin Semiconductor (qing Dao) Ltd. | 60 |
2 |
E. I. du Pont de Nemours and Company | 4345 |
1 |
Renesas Technology Corp. | 186 |
1 |
Tokyo Electron Limited | 11599 |
1 |
Hyundai Motor Company | 19021 |
1 |
Systems on Silicon Manufacturing Co. Pte. Ltd. | 7 |
1 |
Other owners | 23 |